- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Height：
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- Plating：
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- Attachment Method：
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- Conditions sélectionnées:
Découvrez les produits 7
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SLMT,2F,SNB
|
Slot Mount | - | - | - | - | - | - | - | ||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 040 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.38 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.38 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 070 SN 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.060" (1.52mm) | Tin | Flash | Adhesive |
