- Fabricant：
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- Packaging：
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- Series：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Frequency：
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- Memory Size：
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- Power - Output：
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- Protocol：
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- Serial Interfaces：
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- Current - Receiving：
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- RF Family/Standard：
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- Modulation：
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- GPIO：
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- Current - Transmitting：
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- Conditions sélectionnées:
Découvrez les produits 614
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Type | Frequency | Memory Size | Sensitivity | Power - Output | Protocol | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Type | Frequency | Memory Size | Sensitivity | Power - Output | Protocol | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | |
|
Broadcom Limited |
417
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SINGLE CHIP 3X3 11 AC
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Broadcom Limited |
385
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SINGLE CHIP 3X3 11 AC
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Broadcom Limited |
357
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
2X2 11AC
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Broadcom Limited |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SINGLE CHIP 3X3 11 AC
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Microchip Technology |
3,476
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOC BLE 4.1 ULT LOW PWR 48QFN
|
Cut Tape (CT) | - | 2.3 V ~ 4.3 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | TxRx + MCU | 2.4GHz | 256kB Flash，128kB ROM，128kB RAM | -96dBm | 3.5dBm | Bluetooth v4.1 | I2C，SPI，UART | 4.2mA | Bluetooth | - | 30 | 3mA | |||
|
|
Toshiba Semiconductor and Storage |
2,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
COMBO WIRELESS CHIP SUPPORTING B
|
Tape & Reel (TR) | - | - | - | 52-TFBGA | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
COMBO WIRELESS CHIP SUPPORTING B
|
Cut Tape (CT) | - | - | - | 52-TFBGA | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
COMBO WIRELESS CHIP SUPPORTING B
|
- | - | - | - | 52-TFBGA | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SINGLE-CHIP BLUETOOTH
|
Tape & Reel (TR) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SINGLE-CHIP BLUETOOTH
|
Cut Tape (CT) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SINGLE-CHIP BLUETOOTH
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Cypress Semiconductor Corp |
2,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 76WLCSP
|
Tape & Reel (TR) | - | 1.9 V ~ 5.5 V | -40°C ~ 105°C | 76-XFBGA，WLCSP | TxRx + MCU | 2.4GHz | 256kB Flash，32kB SRAM | -92dBm | 3dBm | Bluetooth v4.2 | I2C，I2S，SPI，UART | - | Bluetooth | - | 36 | - | |||
|
|
Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 76WLCSP
|
Cut Tape (CT) | - | 1.9 V ~ 5.5 V | -40°C ~ 105°C | 76-XFBGA，WLCSP | TxRx + MCU | 2.4GHz | 256kB Flash，32kB SRAM | -92dBm | 3dBm | Bluetooth v4.2 | I2C，I2S，SPI，UART | - | Bluetooth | - | 36 | - | |||
|
|
Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 76WLCSP
|
- | - | 1.9 V ~ 5.5 V | -40°C ~ 105°C | 76-XFBGA，WLCSP | TxRx + MCU | 2.4GHz | 256kB Flash，32kB SRAM | -92dBm | 3dBm | Bluetooth v4.2 | I2C，I2S，SPI，UART | - | Bluetooth | - | 36 | - | |||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Tape & Reel (TR) | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | TxRx + MCU | 2.4GHz | 256kB Flash，384kB ROM，192kB RAM | -94dBm | 0dBm | Bluetooth v4.2 | I2C，SPI | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA | |||
|
|
Toshiba Semiconductor and Storage |
1,985
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Cut Tape (CT) | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | TxRx + MCU | 2.4GHz | 256kB Flash，384kB ROM，192kB RAM | -94dBm | 0dBm | Bluetooth v4.2 | I2C，SPI | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA | |||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
- | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | TxRx + MCU | 2.4GHz | 256kB Flash，384kB ROM，192kB RAM | -94dBm | 0dBm | Bluetooth v4.2 | I2C，SPI | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA | |||
|
|
Silicon Labs |
306
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RF ICS + MODULES IEEE 802.15.4
|
Tray | - | - | - | Module | - | - | - | - | - | - | - | - | - | - | - | - | |||
|
|
Microchip Technology |
22
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MCU SOC BLE 4.1 ULT LOW 32CSP
|
Cut Tape (CT) | - | 1.8 V ~ 4.3 V | -40°C ~ 85°C | 32-UFBGA，WLCSP | TxRx + MCU | 2.4GHz | 128kB ROM，128kB RAM | -96dBm | 4dBm | Bluetooth v4.1 | I2C，SPI，UART | 4mA | Bluetooth | - | 13 | 3mA | |||
|
|
Microchip Technology |
10
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 48VFQFN
|
- | - | 2.3 V ~ 4.3 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | TxRx + MCU | 2.4GHz | 256kB Flash，128kB ROM，128kB RAM | -96dBm | 3.5dBm | Bluetooth v4.1 | I2C，SPI，UART | 4.2mA | Bluetooth | - | 30 | 3mA ~ 4mA |
