- Packaging:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Memory Size:
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- Sensitivity:
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- Serial Interfaces:
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- Modulation:
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- Current - Transmitting:
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- Conditions sélectionnées:
Découvrez les produits 38
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Serial Interfaces | Current - Receiving | Modulation | GPIO | Current - Transmitting | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Serial Interfaces | Current - Receiving | Modulation | GPIO | Current - Transmitting | ||
Dialog Semiconductor GmbH |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Tape & Reel (TR) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 64kB OTP,128kB ROM,144kB SRAM | -94dBm | 0dBm | I2C,I2S,PCM,SPI,UART,USB | - | - | - | - | ||||
Dialog Semiconductor GmbH |
5,553
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Cut Tape (CT) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 64kB OTP,128kB ROM,144kB SRAM | -94dBm | 0dBm | I2C,I2S,PCM,SPI,UART,USB | - | - | - | - | ||||
Dialog Semiconductor GmbH |
5,553
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
- | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 64kB OTP,128kB ROM,144kB SRAM | -94dBm | 0dBm | I2C,I2S,PCM,SPI,UART,USB | - | - | - | - | ||||
Qualcomm |
2,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH
|
Tape & Reel (TR) | BlueCore | 3.3V | - | - | 16MB Flash | -90dBm | 8.5dBm | I2S | - | - | 2 | - | ||||
Qualcomm |
2,023
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH
|
Cut Tape (CT) | BlueCore | 3.3V | - | - | 16MB Flash | -90dBm | 8.5dBm | I2S | - | - | 2 | - | ||||
Qualcomm |
2,023
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH
|
- | BlueCore | 3.3V | - | - | 16MB Flash | -90dBm | 8.5dBm | I2S | - | - | 2 | - | ||||
Dialog Semiconductor GmbH |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Tape & Reel (TR) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 8Mb Flash,64kB OTP,128kB ROM,144kB SRAM | -94dBm | 0dBm | I2C,I2S,PCM,SPI,UART,USB | - | - | - | - | ||||
Dialog Semiconductor GmbH |
6,285
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Cut Tape (CT) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 8Mb Flash,64kB OTP,128kB ROM,144kB SRAM | -94dBm | 0dBm | I2C,I2S,PCM,SPI,UART,USB | - | - | - | - | ||||
Dialog Semiconductor GmbH |
6,285
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
- | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 8Mb Flash,64kB OTP,128kB ROM,144kB SRAM | -94dBm | 0dBm | I2C,I2S,PCM,SPI,UART,USB | - | - | - | - | ||||
Texas Instruments |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
DUAL-MODE BLUETOOTH CONTROLLER
|
Tape & Reel (TR) | - | 1.7 V ~ 4.8 V | -40°C ~ 85°C | 76-VQFN Dual Rows,Exposed Pad | - | -95dBm | 12dBm | UART | - | 4DQPSK,8DPSK,GFSK | - | 112.5mA | ||||
Texas Instruments |
425
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
DUAL-MODE BLUETOOTH CONTROLLER
|
Cut Tape (CT) | - | 1.7 V ~ 4.8 V | -40°C ~ 85°C | 76-VQFN Dual Rows,Exposed Pad | - | -95dBm | 12dBm | UART | - | 4DQPSK,8DPSK,GFSK | - | 112.5mA | ||||
Texas Instruments |
425
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
DUAL-MODE BLUETOOTH CONTROLLER
|
- | - | 1.7 V ~ 4.8 V | -40°C ~ 85°C | 76-VQFN Dual Rows,Exposed Pad | - | -95dBm | 12dBm | UART | - | 4DQPSK,8DPSK,GFSK | - | 112.5mA | ||||
NXP USA Inc. |
2,175
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX-
|
Tray | - | 1.71 V ~ 3.6 V | - | 48-VFQFN | 512kB Flash,128kB RAM | -102dBm | 4dBm | I2C,SPI,UART | 6.2mA | - | - | 6mA | ||||
NXP USA Inc. |
1,214
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX-
|
Tray | - | 1.71 V ~ 3.6 V | - | 48-VFQFN | 512kB Flash,128kB RAM | -102dBm | 4dBm | I2C,SPI,UART | 6.2mA | - | - | 6mA | ||||
Texas Instruments |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
ORCA REV C
|
Tape & Reel (TR) | - | 1.7 V ~ 4.8 V | -40°C ~ 85°C | 76-VQFN Dual Rows,Exposed Pad | - | -96dBm | 10dBm | UART | - | 8DPSK,DQPSK,GFSK | - | 112.5mA | ||||
Dialog Semiconductor GmbH |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 53WLCSP
|
Tape & Reel (TR) | SmartBond | 1.7 V ~ 4.5 V | - | 53-BGA,WLCSP | 64kB OTP,128kB ROM,144kB SRAM | -94dBm | 0dBm | I2C,I2S,PCM,SPI,UART,USB | - | - | - | - | ||||
Dialog Semiconductor GmbH |
7,718
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 53WLCSP
|
Cut Tape (CT) | SmartBond | 1.7 V ~ 4.5 V | - | 53-BGA,WLCSP | 64kB OTP,128kB ROM,144kB SRAM | -94dBm | 0dBm | I2C,I2S,PCM,SPI,UART,USB | - | - | - | - | ||||
Dialog Semiconductor GmbH |
7,718
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 53WLCSP
|
- | SmartBond | 1.7 V ~ 4.5 V | - | 53-BGA,WLCSP | 64kB OTP,128kB ROM,144kB SRAM | -94dBm | 0dBm | I2C,I2S,PCM,SPI,UART,USB | - | - | - | - | ||||
NXP USA Inc. |
177
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX-
|
Tray | - | 1.71 V ~ 3.6 V | - | 48-VFQFN | 256kB Flash,64kB RAM | -102dBm | 4dBm | I2C,SPI,UART | 6.2mA | - | - | 6mA | ||||
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUTOOTH 112VFBGA
|
Tape & Reel (TR) | BlueCore | 3.3V | - | 112-VFBGA | 16MB Flash | -90dBm | 10dBm | I2S | - | - | 2 | - |