- Operating Temperature：
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- Memory Size：
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- Sensitivity：
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- Power - Output：
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- Protocol：
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- Serial Interfaces：
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- Current - Receiving：
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- RF Family/Standard：
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- Conditions sélectionnées:
Découvrez les produits 21
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Protocol | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Protocol | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | |
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Texas Instruments |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tube | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | SPI，USART | 27mA | 802.15.4 | - | - | 27mA | ||
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Texas Instruments |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
IC SOC 802.15.4 SENSR NET 48VQFN
|
Tray | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | - | 27mA | 802.15.4 | - | - | 27mA | ||
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|
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU IEEE802.15.4 512K 40HVQFN
|
Tray | -40°C ~ 125°C | 40-VFQFN Exposed Pad | 512kB Flash，4kB EEPROM，32kB RAM | -96dBm | 10dBm | ZigBee? | I2C，SPI，UART | 14.7mA | 802.15.4 | - | 20 | 23mA | ||
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Texas Instruments |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tape & Reel (TR) | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | SPI，USART | 27mA | 802.15.4 | - | - | 27mA | ||
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|
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Texas Instruments |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Cut Tape (CT) | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | SPI，USART | 27mA | 802.15.4 | - | - | 27mA | ||
|
|
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Texas Instruments |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
- | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | SPI，USART | 27mA | 802.15.4 | - | - | 27mA | ||
|
|
|
Texas Instruments |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tape & Reel (TR) | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | SPI，USART | 27mA | 802.15.4 | - | - | 27mA | ||
|
|
|
Texas Instruments |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Cut Tape (CT) | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | SPI，USART | 27mA | 802.15.4 | - | - | 27mA | ||
|
|
|
Texas Instruments |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
- | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | SPI，USART | 27mA | 802.15.4 | - | - | 27mA | ||
|
|
|
Texas Instruments |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tray | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | SPI，USART | 27mA | 802.15.4 | - | - | 27mA | ||
|
|
|
Texas Instruments |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tape & Reel (TR) | - | 48-VFQFN Exposed Pad | 128kB Flash，8kB SRAM | - | - | ZigBee? | SPI，USART | 27mA | 802.15.4 | - | - | 27mA | ||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 40-VFQFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 40-VFQFN Exposed Pad | 128kB ROM，32kB RAM | -95dBm | 2.5dBm | ZigBee? | - | 16.5mA | 802.15.4 | - | - | 15mA | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 40-VFQFN
|
Cut Tape (CT) | -40°C ~ 125°C | 40-VFQFN Exposed Pad | 128kB ROM，32kB RAM | -95dBm | 2.5dBm | ZigBee? | - | 16.5mA | 802.15.4 | - | - | 15mA | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 40-VFQFN
|
- | -40°C ~ 125°C | 40-VFQFN Exposed Pad | 128kB ROM，32kB RAM | -95dBm | 2.5dBm | ZigBee? | - | 16.5mA | 802.15.4 | - | - | 15mA | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
RF 802.15.4 MICROCNTLR 2.4GHZ
|
Tape & Reel (TR) | -40°C ~ 125°C | 40-VFQFN Exposed Pad | 128kB ROM，32kB RAM | -95dBm | 2.5dBm | ZigBee? | - | 16.5mA | 802.15.4 | - | - | 15mA | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 40-VFQFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 40-VFQFN Exposed Pad | 128kB ROM，32kB RAM | -95dBm | 2.5dBm | ZigBee? | - | 16.5mA | 802.15.4 | - | - | 15mA | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 40-VFQFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 40-VFQFN Exposed Pad | 128kB ROM，32kB RAM | -95dBm | 2.5dBm | ZigBee? | - | 16.5mA | 802.15.4 | - | - | 15mA | |||
|
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Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Tape & Reel (TR) | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -94dBm | 0dBm | Bluetooth v4.2 | I2C，SPI | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA | |||
|
|
Toshiba Semiconductor and Storage |
1,985
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Cut Tape (CT) | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -94dBm | 0dBm | Bluetooth v4.2 | I2C，SPI | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA | |||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
- | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -94dBm | 0dBm | Bluetooth v4.2 | I2C，SPI | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA |
