- Packaging：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Frequency：
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- Memory Size：
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- Sensitivity：
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- Protocol：
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- Serial Interfaces：
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- RF Family/Standard：
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- Modulation：
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- Conditions sélectionnées:
Découvrez les produits 10
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Frequency | Memory Size | Sensitivity | Power - Output | Protocol | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | Current - Transmitting | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Frequency | Memory Size | Sensitivity | Power - Output | Protocol | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | Current - Transmitting | |
|
|
|
TDK Corporation |
1,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 36-SMD
|
Tape & Reel (TR) | 2.35 V ~ 3.3 V | -20°C ~ 70°C | 36-SMD Module | 2.4GHz | 32kB OTP，84kB ROM，50kB SRAM | -94dBm | 0dBm | Bluetooth v4.1 | I2C，SPI，UART | 5.4mA | Bluetooth | - | 5mA | ||
|
|
|
TDK Corporation |
1,150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 36-SMD
|
Cut Tape (CT) | 2.35 V ~ 3.3 V | -20°C ~ 70°C | 36-SMD Module | 2.4GHz | 32kB OTP，84kB ROM，50kB SRAM | -94dBm | 0dBm | Bluetooth v4.1 | I2C，SPI，UART | 5.4mA | Bluetooth | - | 5mA | ||
|
|
|
TDK Corporation |
1,150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 36-SMD
|
- | 2.35 V ~ 3.3 V | -20°C ~ 70°C | 36-SMD Module | 2.4GHz | 32kB OTP，84kB ROM，50kB SRAM | -94dBm | 0dBm | Bluetooth v4.1 | I2C，SPI，UART | 5.4mA | Bluetooth | - | 5mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
RF WIRELESS PLATFORM UHF
|
Tape & Reel (TR) | 1.9 V ~ 5.5 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | - | -124dBm | 14dBm | - | SPI，UART | - | - | ASK，FSK | 29mA | ||
|
|
|
NXP USA Inc. |
2,680
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RF WIRELESS PLATFORM UHF
|
Cut Tape (CT) | 1.9 V ~ 5.5 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | - | -124dBm | 14dBm | - | SPI，UART | - | - | ASK，FSK | 29mA | ||
|
|
|
NXP USA Inc. |
2,680
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
RF WIRELESS PLATFORM UHF
|
- | 1.9 V ~ 5.5 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | - | -124dBm | 14dBm | - | SPI，UART | - | - | ASK，FSK | 29mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
LOW-POWER MULTI-CHANNEL UHF RF W
|
Tape & Reel (TR) | 1.9 V ~ 5.5 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | - | -124dBm | 14dBm | - | SPI，UART | - | - | ASK，FSK | 29mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
LOW-POWER MULTI-CHANNEL UHF RF W
|
Cut Tape (CT) | 1.9 V ~ 5.5 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | - | -124dBm | 14dBm | - | SPI，UART | - | - | ASK，FSK | 29mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
LOW-POWER MULTI-CHANNEL UHF RF W
|
- | 1.9 V ~ 5.5 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | - | -124dBm | 14dBm | - | SPI，UART | - | - | ASK，FSK | 29mA | ||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
LOW-POWER MULTI-CHANNEL UHF RF W
|
- | 1.9 V ~ 5.5 V | -40°C ~ 85°C | - | - | - | -124dBm | 14dBm | - | SPI，UART | - | - | ASK，FSK | 29mA |
