- Series：
-
- Operating Temperature：
-
- Type：
-
- Material：
-
- Shape：
-
- Height：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Conditions sélectionnées:
Découvrez les produits 3,471
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL NIB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,BF
|
- | - | - | - | - | - | - | - | - | - | - | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 REC
|
- | - | - | - | - | - | - | - | - | - | - | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL SNB PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 NI 16--11-32AF-NI-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 NI 16--11-32RH-NI-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USFT,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,USFT,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 NI 16 NTP--FOLDED SE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,BF,USFT
|
- | - | - | - | - | - | - | - | - | - | - | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,ZNC,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
STS3,STR,ZNY,USFT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,BF,PSA
|
- | - | - | - | - | - | - | - | - | - | - | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCLIP,STR,BF,USFT,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.305" (7.75mm) | 11.945" (303.40mm) | - | - | - | Clip | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,FRG,BF
|
- | - | - | - | - | - | - | - | - | - | - |
