- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Number of Cores/Bus Width：
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- RAM Controllers：
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Découvrez les produits 216
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | Ethernet | SATA | USB | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | RAM Controllers | Ethernet | SATA | USB | |
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 320 MPQ: 1
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IC MPU I.MX6SL 1.0GHZ 432MAPBGA
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Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 320 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
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Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 320 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
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Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 320 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 320 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
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NXP USA Inc. |
84
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX53 32-BIT MPU ARM CORTEX-A8
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Tray | i.MX53 | -20°C ~ 70°C (TA) | 529-FBGA | 529-TEPBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 1GHz | 1 Core，32-Bit | LPDDR2，DDR2，DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | |||
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NXP USA Inc. |
30
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3 jours |
-
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MOQ: 1 MPQ: 1
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I.MX 6DL ROM PERF ENHAN
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Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | |||
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NXP USA Inc. |
500
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3 jours |
-
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MOQ: 500 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
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Tape & Reel (TR) | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 800MHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | |||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU QUAD A
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.2GHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
|
Tape & Reel (TR) | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
|
Tape & Reel (TR) | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tape & Reel (TR) | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tape & Reel (TR) | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 160 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 160 MPQ: 1
|
I.MX6 SL ROM ENHANCE
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 160 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | 1 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX53 32-BIT MPU ARM CORTEX-A8
|
Tape & Reel (TR) | i.MX53 | -20°C ~ 70°C (TA) | 529-FBGA | 529-TEPBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 1GHz | 1 Core，32-Bit | LPDDR2，DDR2，DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | |||
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 500 MPQ: 1
|
I.MX 6DL ROM PERF ENHAN
|
Tape & Reel (TR) | i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX53 32-BIT MPU ARM CORTEX-A8
|
Tape & Reel (TR) | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-TEPBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 800MHz | 1 Core，32-Bit | LPDDR2，DDR2，DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | |||
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 750 MPQ: 1
|
I.MX53 32-BIT MPU ARM CORTEX-A8
|
Tape & Reel (TR) | i.MX53 | -40°C ~ 85°C (TA) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 800MHz | 1 Core，32-Bit | LPDDR2，DDR2，DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) |
