- Packaging:
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- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- RAM Controllers:
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- SATA:
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Découvrez les produits 87
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | RAM Controllers | Ethernet | SATA | USB | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | RAM Controllers | Ethernet | SATA | USB | ||
NXP USA Inc. |
1,129
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
230
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
1,173
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
1,825
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
446
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
1,680
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 1.0GHZ 529TEBGA-2
|
Tray | i.MX53 | -20°C ~ 85°C (TC) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 1.0GHz | LPDDR2,DDR2,DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
313
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||||
NXP USA Inc. |
773
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||||
NXP USA Inc. |
761
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 800MHz | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
1,917
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 800MHz | LPDDR2,DDR2,DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
442
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Tray | i.MX53 | -40°C ~ 85°C (TA) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 800MHz | LPDDR2,DDR2,DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
1,385
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||||
NXP USA Inc. |
1,353
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||||
NXP USA Inc. |
653
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
147
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 800MHz | LPDDR2,DDR2,DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||||
NXP USA Inc. |
159
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||||
NXP USA Inc. |
92
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V,1.8V,3.0V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | ||||
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
II.MX 6S ROM PERF ENHAN
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1.0GHz | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) |