- Packaging:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Number of Cores/Bus Width:
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- RAM Controllers:
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Découvrez les produits 72
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | RAM Controllers | Ethernet | SATA | USB | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | RAM Controllers | Ethernet | SATA | USB | ||
NXP USA Inc. |
1,825
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
446
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
499
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
936
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 800MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 105°C (TA) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
592
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 800MHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 105°C (TA) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
761
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
1,917
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 1 Core,32-Bit | LPDDR2,DDR2,DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
442
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Tray | i.MX53 | -40°C ~ 85°C (TA) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 1 Core,32-Bit | LPDDR2,DDR2,DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
147
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V,1.8V,2.775V,3.3V | 1 Core,32-Bit | LPDDR2,DDR2,DDR3 | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2),USB 2.0 + PHY (2) | ||||
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
55
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
58
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
235
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 800MHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 105°C (TA) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 1 Core,32-Bit | LPDDR2,LVDDR3,DDR3 | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) |