- Operating Temperature：
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- Package / Case：
-
- Supplier Device Package：
-
- Number of I/O：
-
- Number of LABs/CLBs：
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- Number of Logic Elements/Cells：
-
- Conditions sélectionnées:
Découvrez les produits 301
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | Number of LABs/CLBs | Number of Logic Elements/Cells | Total RAM Bits | |
|
|
|
Intel |
869
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 182 I/O 256FBGA
|
-40°C ~ 100°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 182 | 645 | 10320 | 423936 | ||
|
|
|
Intel |
142
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 182 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 182 | 645 | 10320 | 423936 | ||
|
|
|
Intel |
1,909
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 168 | 963 | 15408 | 516096 | ||
|
|
|
Intel |
547
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 82 I/O 144EQFP
|
0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 82 | 1539 | 24624 | 608256 | ||
|
|
|
Intel |
201
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 148 I/O 240QFP
|
0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) | 148 | 1539 | 24624 | 608256 | ||
|
|
|
Intel |
319
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 92 I/O 164MBGA
|
-40°C ~ 100°C (TJ) | 164-TFBGA | 164-MBGA (8x8) | 92 | 963 | 15408 | 516096 | ||
|
|
|
Intel |
106
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 168 | 963 | 15408 | 516096 | ||
|
|
|
Intel |
574
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 156 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 156 | 1539 | 24624 | 608256 | ||
|
|
|
Intel |
771
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 215 I/O 324FBGA
|
0°C ~ 85°C (TJ) | 324-BGA | 324-FBGA (19x19) | 215 | 1539 | 24624 | 608256 | ||
|
|
|
Intel |
161
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 346 | 963 | 15408 | 516096 | ||
|
|
|
Intel |
655
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 82 I/O 144EQFP
|
-40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 82 | 1539 | 24624 | 608256 | ||
|
|
|
Intel |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 156 I/O 256FBGA
|
-40°C ~ 100°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 156 | 1539 | 24624 | 608256 | ||
|
|
|
Intel |
308
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 215 I/O 324FBGA
|
-40°C ~ 100°C (TJ) | 324-BGA | 324-FBGA (19x19) | 215 | 1539 | 24624 | 608256 | ||
|
|
|
Intel |
452
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 128 I/O 240QFP
|
0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) | 128 | 2475 | 39600 | 1161216 | ||
|
|
|
Intel |
176
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 195 I/O 324FBGA
|
0°C ~ 85°C (TJ) | 324-BGA | 324-FBGA (19x19) | 195 | 2475 | 39600 | 1161216 | ||
|
|
|
Intel |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 | 2475 | 39600 | 1161216 | ||
|
|
|
Intel |
148
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 | 2475 | 39600 | 1161216 | ||
|
|
|
Intel |
38
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 535 I/O 780FBGA
|
0°C ~ 85°C (TJ) | 780-BGA | 780-FBGA (29x29) | 535 | 2475 | 39600 | 1161216 | ||
|
|
|
Intel |
71
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 195 I/O 324FBGA
|
-40°C ~ 100°C (TJ) | 324-BGA | 324-FBGA (19x19) | 195 | 2475 | 39600 | 1161216 | ||
|
|
|
Intel |
295
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
-40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 | 2475 | 39600 | 1161216 |
