- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Conditions sélectionnées:
Découvrez les produits 37
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | |
|
|
|
Intel |
452
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 128 I/O 240QFP
|
0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) | 128 | ||
|
|
|
Intel |
176
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 195 I/O 324FBGA
|
0°C ~ 85°C (TJ) | 324-BGA | 324-FBGA (19x19) | 195 | ||
|
|
|
Intel |
60
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 | ||
|
|
|
Intel |
148
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 | ||
|
|
|
Intel |
38
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 535 I/O 780FBGA
|
0°C ~ 85°C (TJ) | 780-BGA | 780-FBGA (29x29) | 535 | ||
|
|
|
Intel |
71
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 195 I/O 324FBGA
|
-40°C ~ 100°C (TJ) | 324-BGA | 324-FBGA (19x19) | 195 | ||
|
|
|
Intel |
295
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
-40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 | ||
|
|
|
Intel |
282
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 | ||
|
|
|
Intel |
107
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 535 I/O 780FBGA
|
0°C ~ 85°C (TJ) | 780-BGA | 780-FBGA (29x29) | 535 | ||
|
|
|
Intel |
28
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 535 I/O 780FBGA
|
0°C ~ 85°C (TJ) | 780-BGA | 780-FBGA (29x29) | 535 | ||
|
|
|
Intel |
57
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
-40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 | ||
|
|
|
Intel |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484UBGA
|
-40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | 331 | ||
|
|
|
Intel |
33
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 535 I/O 780FBGA
|
-40°C ~ 100°C (TJ) | 780-BGA | 780-FBGA (29x29) | 535 | ||
|
|
|
Intel |
59
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 195 I/O 324FBGA
|
0°C ~ 85°C (TJ) | 324-BGA | 324-FBGA (19x19) | 195 | ||
|
|
|
Intel |
30
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 535 I/O 780FBGA
|
0°C ~ 85°C (TJ) | 780-BGA | 780-FBGA (29x29) | 535 | ||
|
|
|
Intel |
4
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 195 I/O 324FBGA
|
0°C ~ 85°C (TJ) | 324-BGA | 324-FBGA (19x19) | 195 | ||
|
|
|
Intel |
24
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 | ||
|
|
|
Intel |
22
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 535 I/O 780FBGA
|
-40°C ~ 100°C (TJ) | 780-BGA | 780-FBGA (29x29) | 535 | ||
|
|
|
Intel |
1
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 128 I/O 240QFP
|
0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) | 128 | ||
|
|
|
Intel |
Enquête
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC FPGA 331 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 331 |
