- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Conditions sélectionnées:
Découvrez les produits 48
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | |
|
|
|
Intel |
355
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 84 I/O 144EQFP
|
0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 84 | ||
|
|
|
Intel |
2,487
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 240QFP
|
0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) | 160 | ||
|
|
|
Intel |
308
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 160 I/O 240QFP
|
0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) | 160 | ||
|
|
|
Intel |
566
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 168 | ||
|
|
|
Intel |
176
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256UBGA
|
0°C ~ 85°C (TJ) | 256-LFBGA | 256-UBGA (14x14) | 168 | ||
|
|
|
Intel |
141
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 84 I/O 144EQFP
|
0°C ~ 85°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 84 | ||
|
|
|
Intel |
500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 346 | ||
|
|
|
Intel |
1,909
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 168 | ||
|
|
|
Intel |
319
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 92 I/O 164MBGA
|
-40°C ~ 100°C (TJ) | 164-TFBGA | 164-MBGA (8x8) | 92 | ||
|
|
|
Intel |
106
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256FBGA
|
0°C ~ 85°C (TJ) | 256-LBGA | 256-FBGA (17x17) | 168 | ||
|
|
|
Intel |
161
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 346 | ||
|
|
|
Intel |
169
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484UBGA
|
0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) | 346 | ||
|
|
|
Intel |
140
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256UBGA
|
0°C ~ 85°C (TJ) | 256-LFBGA | 256-UBGA (14x14) | 168 | ||
|
|
|
Intel |
175
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 92 I/O 164MBGA
|
0°C ~ 85°C (TJ) | 164-TFBGA | 164-MBGA (8x8) | 92 | ||
|
|
|
Intel |
118
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 84 I/O 144EQFP
|
-40°C ~ 100°C (TJ) | 144-LQFP Exposed Pad | 144-EQFP (20x20) | 84 | ||
|
|
|
Intel |
83
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484UBGA
|
-40°C ~ 100°C (TJ) | 484-FBGA | 484-UBGA (19x19) | 346 | ||
|
|
|
Intel |
65
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 346 | ||
|
|
|
Intel |
42
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484FBGA
|
-40°C ~ 100°C (TJ) | 484-BGA | 484-FBGA (23x23) | 346 | ||
|
|
|
Intel |
73
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 168 I/O 256UBGA
|
-40°C ~ 100°C (TJ) | 256-LFBGA | 256-UBGA (14x14) | 168 | ||
|
|
|
Intel |
7
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 346 I/O 484FBGA
|
0°C ~ 85°C (TJ) | 484-BGA | 484-FBGA (23x23) | 346 |
