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- Conditions sélectionnées:
Découvrez les produits 180
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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|
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CTS Thermal Management Products |
1,776
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.41"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.410" (35.81mm) | 1.410" (35.81mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 5.60°C/W @ 400 LFM | 16.20°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
192
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.21"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 6.80°C/W @ 400 LFM | 19.60°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
1,248
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PWR MED-HI BLACK TO-3
|
- | Board Level | Aluminum | Square, Pin Fins | 1.780" (45.21mm) | 1.780" (45.21mm) | - | Bolt On | TO-3 | 1.000" (25.40mm) | - | - | 9.00°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
661
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.21"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.555" (14.10mm) | - | 5.20°C/W @ 400 LFM | 16.50°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
652
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.31"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.310" (33.27mm) | 1.310" (33.27mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 6.00°C/W @ 400 LFM | 16.10°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
1,553
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HORZ SIX BLACK TO-220
|
7 | Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.642" (41.70mm) | - | Bolt On | TO-220 | 0.690" (17.53mm) | 9.0W @ 40°C | - | 5.00°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
377
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.81"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.605" (15.37mm) | - | 2.80°C/W @ 400 LFM | 8.10°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
979
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.81"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.50°C/W @ 400 LFM | 10.80°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
546
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.61"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.610" (40.89mm) | 1.610" (40.89mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 4.50°C/W @ 400 LFM | 13.50°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
371
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
360
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/THERMAL TAPE
|
APR | Top Mount | Aluminum | Square, Pin Fins | 1.047" (26.60mm) | 1.047" (26.60mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
1,356
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
368
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
438
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
2,815
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 1.90°C/W @ 200 LFM | - | Black Anodized | ||
|
|
CTS Thermal Management Products |
3,767
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU .91" SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 0.910" (23.11mm) | 0.910" (23.11mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | Black Anodized | |||
|
|
|
CTS Thermal Management Products |
667
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PWR W/PINS BLACK TO-220
|
7 | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 60°C | - | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
953
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PRESS ON .50"H BLK TO-5
|
7 | Top Mount | Aluminum | Cylindrical | - | - | 0.440" (11.18mm) OD | Press Fit | TO-5 | 0.500" (12.70mm) | 2.0W @ 60°C | - | 34.00°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
113
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.71"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.710" (43.43mm) | 1.710" (43.43mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.80°C/W @ 400 LFM | 11.50°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
505
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PWR W/PINS BLACK TO-220
|
7 | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.380" (35.05mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 9.0W @ 40°C | - | 5.70°C/W | Black Anodized |
