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BDN18-3CB/A01
- Description :
- HEATSINK CPU W/ADHESIVE 1.81"SQ
- Cette partie est conforme à RoHS
- Fiche technique (1)
- Ajouter aux favoris
- Ajouter pour comparer
- Attachment Method :
- Thermal Tape, Adhesive (Included)
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.355" (9.02mm)
- Length :
- 1.810" (45.97mm)
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Power Dissipation @ Temperature Rise :
- -
- Series :
- BDN
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 3.50°C/W @ 400 LFM
- Thermal Resistance @ Natural :
- 10.80°C/W
- Type :
- Top Mount
- Width :
- 1.810" (45.97mm)
