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APF19-19-10CB
- Description :
- HEATSINK LOW-PROFILE FORGED
- Cette partie est conforme à RoHS
- Fiche technique (1)
- Ajouter aux favoris
- Ajouter pour comparer
- Attachment Method :
- Thermal Tape, Adhesive (Not Included)
- Diameter :
- -
- Height Off Base (Height of Fin) :
- 0.370" (9.40mm)
- Length :
- 0.748" (19.00mm)
- Material :
- Aluminum
- Material Finish :
- Black Anodized
- Package Cooled :
- Assorted (BGA, LGA, CPU, ASIC...)
- Power Dissipation @ Temperature Rise :
- -
- Series :
- APF
- Shape :
- Square, Fins
- Thermal Resistance @ Forced Air Flow :
- 5.30°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Top Mount
- Width :
- 0.748" (19.00mm)
