Contacts, doigts et joints - Zui Ai Technology（Taiwan）Company.

Series：

Operating Temperature：

Type：

Material：

Shape：

Height：

Length：

Plating：

Plating - Thickness：

Attachment Method：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Series	Operating Temperature	Type	Material	Shape	Height	Length	Plating	Plating - Thickness	Attachment Method
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Series	Operating Temperature	Type	Material	Shape	Height	Length	Plating	Plating - Thickness	Attachment Method
	97052717	Laird Technologies EMI	Enquête	-	-	AP,STR,SNB,PSA MOQ: 1 MPQ: 1	AP,STR,SNB,PSA	-	121°C	Fingerstock	Beryllium Copper	-	0.055" (1.40mm)	16.000" (406.40mm)	Tin	299.21μin (7.60μm)	Adhesive
	97054021	Laird Technologies EMI	Enquête	-	-	AP,STR,SU,PSA MOQ: 1 MPQ: 1	AP,STR,SU,PSA	-	121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	-	-	Adhesive
	0C98054002	Laird Technologies EMI	Enquête	-	-	AP COIL BF USFT PSA MOQ: 1 MPQ: 1	AP COIL BF USFT PSA	All-Purpose	121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Unplated	-	Adhesive
	SG060280R-23.62	Leader Tech Inc.	10	3 jours	-	EMI FABRIC GASKET 1.52X7.11MM MOQ: 1 MPQ: 1	EMI FABRIC GASKET 1.52X7.11MM	-	-40°C ~ 70°C	Fabric Over Foam	Polyurethane Foam，Nickel-Copper Ripstop (NI/CU)	Rectangular	0.060" (1.52mm)	23.62" (599.95mm)	-	-	Non-Conductive Adhesive
	11-28RH-BD-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 BD 16--11-28RH-BD-16 MOQ: 1 MPQ: 1	0.11 X 0.28 BD 16--11-28RH-BD-16	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Unplated	-	Adhesive
	11-S-28RH-BD-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 BD 16--11-S-28RH-BD- MOQ: 1 MPQ: 1	0.11 X 0.28 BD 16--11-S-28RH-BD-	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Unplated	-	Adhesive
	SG060280R-48	Leader Tech Inc.	Enquête	-	-	.060"H X .280"W X 48"L--RECTANGU MOQ: 1 MPQ: 1	.060"H X .280"W X 48"L--RECTANGU	-	-40°C ~ 70°C	Fabric Over Foam	Polyurethane Foam，Nickel-Copper Polyester (NI/CU)	Rectangular	0.060" (1.52mm)	4.00 (1.22m)	-	-	-
	11-28FSV23-NI-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 X 0.23 NI 16--FOLDED MOQ: 1 MPQ: 1	0.11 X 0.28 X 0.23 NI 16--FOLDED	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Nickel	Flash	Adhesive
	98054002	Laird Technologies EMI	Enquête	-	-	AP,STR,BF,USF,PSA MOQ: 1 MPQ: 1	AP,STR,BF,USF,PSA	-	121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	-	-	Adhesive
	11-28FS-NI-16-NTP	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 NI 16 NTP--FOLDED SE MOQ: 1 MPQ: 1	0.11 X 0.28 NI 16 NTP--FOLDED SE	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Nickel	Flash	Adhesive
	11-28FSV23-BD-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 X 0.23 BD 16--FOLDED MOQ: 1 MPQ: 1	0.11 X 0.28 X 0.23 BD 16--FOLDED	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Unplated	-	Adhesive
	11-28FS-BD-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 BD 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.11 X 0.28 BD 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Unplated	-	Adhesive
	11-S-28FSV23-BD-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 X 0.24 BD 16.0--FOLD MOQ: 1 MPQ: 1	0.11 X 0.28 X 0.24 BD 16.0--FOLD	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Unplated	-	Adhesive
	11-S-28FS-BD-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 BD 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.11 X 0.28 BD 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Unplated	-	Adhesive
	11-28FSV23-SN-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 X 0.23 SN 16--FOLDED MOQ: 1 MPQ: 1	0.11 X 0.28 X 0.23 SN 16--FOLDED	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Tin	Flash	Adhesive
	11-S-28FSV23-SN-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 X 0.24 SN 16.0--FOLD MOQ: 1 MPQ: 1	0.11 X 0.28 X 0.24 SN 16.0--FOLD	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Tin	Flash	Adhesive
	11-28FS-SN-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 SN 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.11 X 0.28 SN 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Tin	Flash	Adhesive
	11-28FS-NI-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 NI 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.11 X 0.28 NI 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Nickel	Flash	Adhesive
	11-S-28FS-SN-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 SN 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.11 X 0.28 SN 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Tin	Flash	Adhesive
	11-S-28FSV23-NI-16	Leader Tech Inc.	Enquête	-	-	0.11 X 0.28 X 0.24 NI 16.0--FOLD MOQ: 1 MPQ: 1	0.11 X 0.28 X 0.24 NI 16.0--FOLD	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.110" (2.79mm)	16.000" (406.40mm)	Nickel	Flash	Adhesive

Envoyé avec succès!