- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Conditions sélectionnées:
Découvrez les produits 36
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
328
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.11X406.4MM
|
- | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
102
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.055" (1.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NID,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNC,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNY,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIE,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.055" (1.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SU,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | - | - | Adhesive | ||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-28RH-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-S-28RH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.23 NI 16--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | Nickel | Flash | Adhesive |
