- Operating Temperature：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Conditions sélectionnées:
Découvrez les produits 104
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16 NTP--22-60AH-B
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 NI 16--22-60RH-NI-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Nickel | Flash | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.60 BD 16--12-60LPAH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16--22-S-60AH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 SN 16--22-60AH-SN-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16--22-S-60RH-BD-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.60 SN 16--12-60LPAH-SN-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 NI 16--22-60AH-NI-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 SN 16--22-60RH-SN-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24 NTP--FOLDED SE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 MAG 24--FOLDED SERIE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Silver | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 SNPB 24--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Lead，Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 NI 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.040"H X .060"W X 30"L--D SHAPED
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.040" (1.02mm) | 30.000" (762.00mm) | - | - | - |
