- Operating Temperature：
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- Type：
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- Material：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Conditions sélectionnées:
Découvrez les produits 27
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
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|
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Laird Technologies EMI |
244
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.60MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
447
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 15.24X609.6MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
71
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | - | - | Slot | ||
|
|
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Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNSAT,PSA
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNC,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SU,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,CDC,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Cadmium + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
HDWE GROUNDING STRIP
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,COIL,BF,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL SNB PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24 NTP--FOLDED SE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive |
