- Operating Temperature：
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- Conditions sélectionnées:
Découvrez les produits 104
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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VSLMT,STR,SNB
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Slot | ||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,NID
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,ZNY
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 16.000" (406.40mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,SNB
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SU,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,CDC,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Cadmium + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,ZNY,DLN
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 16.000" (406.40mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X42.16MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 1.660" (42.16mm) | - | - | Slot | ||
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
.250"H X .600"W X 10"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.250" (6.35mm) | 10.000" (254.00mm) | - | - | - | |||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
HDWE GROUNDING STRIP
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Tin | Flash | Adhesive | |||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
AP,COIL,BF,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | - | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 3--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 3.000" (76.20mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16--22-S-60AF-BD-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
AP COIL SNB PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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|
Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16--22-60RH-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
0.22 X 0.62 BD 15--22-S-62DTS-BD
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 16.000" (406.40mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16--22-60AH-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 16.000" (406.40mm) | Unplated | - | Adhesive |
