- Series:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Conditions sélectionnées:
Découvrez les produits 15
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 448 I/O 560MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 448 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 448 I/O 560MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 448 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 448 I/O 560MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 448 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 448 I/O 560MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 448 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 448 I/O 560MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 448 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 448 I/O 560MBGA
|
XC4000E/X | -40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 448 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 256 I/O 304HQFP
|
XC4000XLA/XV | -40°C ~ 100°C (TJ) | 304-BFQFP Exposed Pad | 304-PQFP (40x40) | 256 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC FPGA 352 I/O 432MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 432-LBGA Exposed Pad,Metal | 432-MBGA (40x40) | 352 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 12 MPQ: 1
|
IC FPGA 448 I/O 560MBGA
|
XC4000E/X | 0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 448 |