Supplier Device Package:
Number of Gates:
Number of I/O:
Number of LABs/CLBs:
Number of Logic Elements/Cells:
Total RAM Bits:
Découvrez les produits 5
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of Gates Number of I/O Number of LABs/CLBs Number of Logic Elements/Cells Total RAM Bits
XA3SD1800A-4FGG676I
Xilinx Inc.
Enquête
-
-
MOQ: 40  MPQ: 1
IC FPGA 519 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BGA 676-FBGA (27x27) 1800000 519 4160 37440 1548288
XA3SD1800A-4CSG484Q
Xilinx Inc.
Enquête
-
-
MOQ: 84  MPQ: 1
IC FPGA 309 I/O 484CSBG
-40°C ~ 125°C (TJ) 484-FBGA,CSPBGA 484-CSPBGA (19x19) 1800000 309 4160 37440 1548288
XA3SD1800A-4FGG676Q
Xilinx Inc.
Enquête
-
-
MOQ: 40  MPQ: 1
IC FPGA 519 I/O 676FBGA
-40°C ~ 125°C (TJ) 676-BGA 676-FBGA (27x27) 1800000 519 4160 37440 1548288
XA3SD3400A-4CSG484I
Xilinx Inc.
Enquête
-
-
MOQ: 84  MPQ: 1
IC FPGA 309 I/O 484CSBG
-40°C ~ 100°C (TJ) 484-FBGA,CSPBGA 484-CSPBGA (19x19) 3400000 309 5968 53712 2322432
XA3SD3400A-4FGG676I
Xilinx Inc.
Enquête
-
-
MOQ: 40  MPQ: 1
IC FPGA 469 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BGA 676-FBGA (27x27) 3400000 469 5968 53712 2322432