Découvrez les produits 30
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of I/O
XCV1000E-6FG900C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 900FGBA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 660
XCV1000E-6FG900I
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 900FGBA
-40°C ~ 100°C (TJ) 900-BBGA 900-FBGA (31x31) 660
XCV1000E-7FG900C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 900FGBA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 660
XCV1000E-7FG900I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 900FGBA
-40°C ~ 100°C (TJ) 900-BBGA 900-FBGA (31x31) 660
XCV1000E-8FG900C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 660
XCV1000E-6BG560C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV1000E-6BG560I
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV1000E-6FG1156C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 1156FBGA
0°C ~ 85°C (TJ) 1156-BBGA 1156-FBGA (35x35) 660
XCV1000E-6FG1156I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 1156FBGA
-40°C ~ 100°C (TJ) 1156-BBGA 1156-FBGA (35x35) 660
XCV1000E-6FG680C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV1000E-6FG680I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
-40°C ~ 100°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV1000E-6FG860C
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FGBA
0°C ~ 85°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 660
XCV1000E-6FG860I
Xilinx Inc.
Enquête
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-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FGBA
-40°C ~ 100°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 660
XCV1000E-6HQ240C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 158 I/O 240HQFP
0°C ~ 85°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 158
XCV1000E-6HQ240I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 158 I/O 240HQFP
-40°C ~ 100°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 158
XCV1000E-7BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV1000E-7BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV1000E-7FG1156C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 1156FBGA
0°C ~ 85°C (TJ) 1156-BBGA 1156-FBGA (35x35) 660
XCV1000E-7FG1156I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 1156FBGA
-40°C ~ 100°C (TJ) 1156-BBGA 1156-FBGA (35x35) 660
XCV1000E-7FG680C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512