- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Conditions sélectionnées:
Découvrez les produits 30
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Package / Case | Supplier Device Package | Number of I/O | ||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 900FGBA
|
0°C ~ 85°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 900FGBA
|
-40°C ~ 100°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 900FGBA
|
0°C ~ 85°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 900FGBA
|
-40°C ~ 100°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 900FBGA
|
0°C ~ 85°C (TJ) | 900-BBGA | 900-FBGA (31x31) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 404 I/O 560MBGA
|
0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 404 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 404 I/O 560MBGA
|
-40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 404 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 1156FBGA
|
0°C ~ 85°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 1156FBGA
|
-40°C ~ 100°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 512 I/O 680FBGA
|
0°C ~ 85°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) | 512 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 512 I/O 680FBGA
|
-40°C ~ 100°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) | 512 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 860FGBA
|
0°C ~ 85°C (TJ) | 860-BGA | 860-FBGA (42.5x42.5) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 860FGBA
|
-40°C ~ 100°C (TJ) | 860-BGA | 860-FBGA (42.5x42.5) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 158 I/O 240HQFP
|
0°C ~ 85°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) | 158 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 158 I/O 240HQFP
|
-40°C ~ 100°C (TJ) | 240-BFQFP Exposed Pad | 240-PQFP (32x32) | 158 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 404 I/O 560MBGA
|
0°C ~ 85°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 404 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 404 I/O 560MBGA
|
-40°C ~ 100°C (TJ) | 560-LBGA Exposed Pad,Metal | 560-MBGA (42.5x42.5) | 404 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 1156FBGA
|
0°C ~ 85°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 660 I/O 1156FBGA
|
-40°C ~ 100°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) | 660 | ||||
Xilinx Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC FPGA 512 I/O 680FBGA
|
0°C ~ 85°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) | 512 |