Découvrez les produits 213
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Package / Case Supplier Device Package Number of Gates Number of I/O Number of LABs/CLBs Number of Logic Elements/Cells Total RAM Bits
XCV1600E-6FG680C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 2188742 512 7776 34992 589824
XCV1600E-6FG680I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
-40°C ~ 100°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 2188742 512 7776 34992 589824
XCV1600E-6FG860C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
0°C ~ 85°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 2188742 660 7776 34992 589824
XCV1600E-6FG860I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
-40°C ~ 100°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 2188742 660 7776 34992 589824
XCV1600E-7BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 2188742 404 7776 34992 589824
XCV1600E-7BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 2188742 404 7776 34992 589824
XCV1600E-7FG1156C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 724 I/O 1156FBGA
0°C ~ 85°C (TJ) 1156-BBGA 1156-FBGA (35x35) 2188742 724 7776 34992 589824
XCV1600E-7FG1156I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 724 I/O 1156FBGA
-40°C ~ 100°C (TJ) 1156-BBGA 1156-FBGA (35x35) 2188742 724 7776 34992 589824
XCV1600E-7FG680C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 2188742 512 7776 34992 589824
XCV1600E-7FG680I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
-40°C ~ 100°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 2188742 512 7776 34992 589824
XCV1600E-7FG860C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
0°C ~ 85°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 2188742 660 7776 34992 589824
XCV1600E-7FG860I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
-40°C ~ 100°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 2188742 660 7776 34992 589824
XCV1600E-8BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 2188742 404 7776 34992 589824
XCV1600E-8FG1156C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 724 I/O 1156FBGA
0°C ~ 85°C (TJ) 1156-BBGA 1156-FBGA (35x35) 2188742 724 7776 34992 589824
XCV1600E-8FG680C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 2188742 512 7776 34992 589824
XCV1600E-8FG860C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
0°C ~ 85°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 2188742 660 7776 34992 589824
XCV2000E-6BG560C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 2541952 404 9600 43200 655360
XCV2000E-6BG560I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 2541952 404 9600 43200 655360
XCV2000E-6FG1156C
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 804 I/O 1156FBGA
0°C ~ 85°C (TJ) 1156-BBGA 1156-FBGA (35x35) 2541952 804 9600 43200 655360
XCV2000E-6FG1156I
Xilinx Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
IC FPGA 804 I/O 1156FBGA
-40°C ~ 100°C (TJ) 1156-BBGA 1156-FBGA (35x35) 2541952 804 9600 43200 655360