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SA143040
- Description :
- CONN IC DIP SOCKET 14POS GOLD
- Cette partie est conforme à RoHS
- Fiche technique (1)
- Ajouter aux favoris
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- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- Flash
- Contact Finish Thickness - Post :
- 80μin (2.03μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Open Frame
- Housing Material :
- Thermoplastic，Polyester，Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 14 (2 x 7)
- Operating Temperature :
- -40°C ~ 105°C
- Packaging :
- Tube
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- SA
- Termination :
- Solder
- Type :
- DIP，0.3" (7.62mm) Row Spacing
- 倍数 :
- 1
