4-1571551-5

Description :
CONN IC DIP SOCKET 18POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
25μin (0.63μm)
Contact Finish Thickness - Post :
25μin (0.63μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Nickel
Features :
Closed Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT),Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
18 (2 x 9)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Tube
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
500
Termination :
Solder
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

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