44-547-11

Description :
CONN SOCKET SOIC ZIF 44POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
20μin (0.51μm)
Contact Finish Thickness - Post :
20μin (0.51μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyphenylene Sulfide (PPS),Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
44 (2 x 22)
Operating Temperature :
-
Packaging :
Bulk
Pitch - Mating :
-
Pitch - Post :
0.050" (1.27mm)
Series :
547
Termination :
Solder
Type :
SOIC,ZIF (ZIP)
倍数 :
1

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