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08-3518-00
- Description :
- CONN IC DIP SOCKET 8POS GOLD
- Cette partie est conforme à RoHS
- Fiche technique (1)
- Ajouter aux favoris
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- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- 10μin (0.25μm)
- Contact Finish Thickness - Post :
- 200μin (5.08μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Brass
- Features :
- Open Frame
- Housing Material :
- Polyamide (PA46)，Nylon 4/6，Glass Filled
- Mounting Type :
- Surface Mount
- Number of Positions or Pins (Grid) :
- 8 (2 x 4)
- Operating Temperature :
- -
- Packaging :
- Bulk
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 518
- Termination :
- Solder
- Type :
- DIP，0.3" (7.62mm) Row Spacing
- 倍数 :
- 1
