3M

224-7397-55-1902

Description :
CONN SOCKET SOIC 24POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
-
Contact Finish Thickness - Post :
30μin (0.76μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Closed Frame
Housing Material :
Polyethersulfone (PES),Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
24 (2 x 12)
Operating Temperature :
-55°C ~ 150°C
Packaging :
Bulk
Pitch - Mating :
-
Pitch - Post :
-
Series :
Textool
Termination :
Solder
Type :
SOIC
倍数 :
1

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