TE Connectivity AMP Connectors

508-AG11D-ES

Description :
CONN IC DIP SOCKET 8POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Mating :
25μin (0.63μm)
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Closed Frame
Housing Material :
Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
8 (2 x 4)
Operating Temperature :
-55°C ~ 105°C
Packaging :
Tube
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
500
Termination :
Solder
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

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