818-AG12D

Description :
CONN IC DIP SOCKET 18POS TINLEAD
Contact Finish - Mating :
Tin-Lead
Contact Finish - Post :
-
Contact Finish Thickness - Mating :
80μin (2.03μm)
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
-
Features :
Open Frame
Housing Material :
Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
18 (2 x 9)
Operating Temperature :
-55°C ~ 105°C
Packaging :
Tube
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
800
Termination :
Solder
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

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