6-1437529-6
- Description :
- CONN IC DIP SOCKET 6POS GOLD
- Cette partie est conforme à RoHS
- Fiche technique (0)
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- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Gold
- Contact Finish Thickness - Mating :
- 20μin (0.51μm)
- Contact Finish Thickness - Post :
- 47μin (1.19μm)
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Copper Alloy
- Features :
- Closed Frame
- Housing Material :
- Thermoplastic，Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 6 (2 x 3)
- Operating Temperature :
- -55°C ~ 105°C
- Packaging :
- Bulk
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 500
- Termination :
- Solder
- Type :
- DIP，0.4" (10.16mm) Row Spacing
- 倍数 :
- 1
