514-AG12D

Description :
CONN IC DIP SOCKET 14POS TINLEAD
Contact Finish - Mating :
Tin-Lead
Contact Finish - Post :
Tin-Lead
Contact Finish Thickness - Mating :
-
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass,Copper
Features :
Closed Frame
Housing Material :
Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
14 (2 x 7)
Operating Temperature :
-55°C ~ 105°C
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
500
Termination :
Solder
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

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