2069965-1

Description :
CONN SOCKET LGA 1155POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
15μin (0.38μm)
Contact Finish Thickness - Post :
15μin (0.38μm)
Contact Material - Mating :
Copper Alloy
Contact Material - Post :
Copper Alloy
Features :
Open Frame
Housing Material :
Thermoplastic
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
1155 (40 x 40)
Operating Temperature :
-
Packaging :
Bulk
Pitch - Mating :
0.036" (0.91mm)
Pitch - Post :
0.036" (0.91mm)
Series :
-
Termination :
Solder
Type :
LGA
倍数 :
1

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