ICF-632-S-O
- Description :
- CONN IC DIP SOCKET 32POS TIN
- Cette partie est conforme à RoHS
- Fiche technique (1)
- Ajouter aux favoris
- Ajouter pour comparer
- Contact Finish - Mating :
- Tin
- Contact Finish - Post :
- Tin
- Contact Finish Thickness - Mating :
- -
- Contact Finish Thickness - Post :
- -
- Contact Material - Mating :
- Beryllium Copper
- Contact Material - Post :
- Beryllium Copper
- Features :
- Open Frame
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Mounting Type :
- Surface Mount
- Number of Positions or Pins (Grid) :
- 32 (2 x 16)
- Operating Temperature :
- -55°C ~ 125°C
- Packaging :
- Tube
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- iCF
- Termination :
- Solder
- Type :
- DIP，0.6" (15.24mm) Row Spacing
- 倍数 :
- 1
