ICF-308-T-O-TR

Description :
CONN IC DIP SOCKET 8POS TIN
Contact Finish - Mating :
Tin
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
-
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Open Frame
Housing Material :
Liquid Crystal Polymer (LCP)
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
8 (2 x 4)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Tape & Reel (TR)
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
iCF
Termination :
Solder
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

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