558-10-356M26-001104

Description :
BGA SURFACE MOUNT 1.27MM
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
10μin (0.25μm)
Contact Finish Thickness - Post :
10μin (0.25μm)
Contact Material - Mating :
Brass
Contact Material - Post :
Brass
Features :
Closed Frame
Housing Material :
FR4 Epoxy Glass
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
356 (26 x 26)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Bulk
Pitch - Mating :
0.050" (1.27mm)
Pitch - Post :
0.050" (1.27mm)
Series :
558
Termination :
Solder
Type :
BGA
倍数 :
1

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