514-87-432M31-001148

Description :
CONN SOCKET BGA 432POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
Flash
Contact Finish Thickness - Post :
-
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled
Mounting Type :
Surface Mount
Number of Positions or Pins (Grid) :
432 (31 x 31)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
514
Termination :
Solder
Type :
BGA
倍数 :
1

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