XR2T-2021-N

Description :
CONN IC DIP SOCKET 20POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Gold
Contact Finish Thickness - Mating :
Flash
Contact Finish Thickness - Post :
Flash
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Open Frame,Seal Tape
Housing Material :
Polybutylene Terephthalate (PBT),Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
20 (2 x 10)
Operating Temperature :
-55°C ~ 125°C
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
XR2
Termination :
Solder
Type :
DIP,0.3" (7.62mm) Row Spacing
倍数 :
1

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