28-3553-18
- Description :
- CONN IC DIP SOCKET ZIF 28POS
- Cette partie est conforme à RoHS
- Fiche technique (0)
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- Contact Finish - Mating :
- Nickel Boron
- Contact Finish - Post :
- Nickel Boron
- Contact Finish Thickness - Mating :
- 50μin (1.27μm)
- Contact Finish Thickness - Post :
- 50μin (1.27μm)
- Contact Material - Mating :
- Beryllium Nickel
- Contact Material - Post :
- Beryllium Nickel
- Features :
- Closed Frame
- Housing Material :
- Polyetheretherketone (PEEK)，Glass Filled
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 28 (2 x 14)
- Operating Temperature :
- -55°C ~ 250°C
- Packaging :
- Bulk
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Series :
- 55
- Termination :
- Solder
- Type :
- DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing
- 倍数 :
- 1
