02-1518-10T

Description :
CONN IC DIP SOCKET 2POS GOLD
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
10μin (0.25μm)
Contact Finish Thickness - Post :
200μin (5.08μm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Brass
Features :
Open Frame
Housing Material :
Polyamide (PA46),Nylon 4/6,Glass Filled
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
2 (1 x 2)
Operating Temperature :
-
Packaging :
Bulk
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
518
Termination :
Solder
Type :
DIP,0.2" (5.08mm) Row Spacing
倍数 :
1

Produits similaires