Apex Microtechnology

HS35

Description :
HEATSINK OPEN FRAME
Attachment Method :
-
Diameter :
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Height Off Base (Height of Fin) :
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Length :
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Material :
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Material Finish :
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Package Cooled :
-
Power Dissipation @ Temperature Rise :
-
Series :
-
Shape :
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Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
-
Type :
-
Width :
-

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