6030D(COPPER)G

Description :
BOARD LEVEL HEAT SINK
Attachment Method :
Bolt On and PC Pin
Diameter :
-
Height Off Base (Height of Fin) :
0.500" (12.70mm)
Length :
1.180" (29.97mm)
Material :
Copper
Material Finish :
Tin
Package Cooled :
TO-220
Power Dissipation @ Temperature Rise :
1.0W @ 20°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
6.00°C/W @ 300 LFM
Thermal Resistance @ Natural :
12.50°C/W
Type :
Board Level, Vertical
Width :
1.000" (25.40mm)

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