573400D00010G

Description :
HEATSINK D-PAK3 TIN PLATED SMD
Attachment Method :
SMD Pad
Diameter :
-
Height Off Base (Height of Fin) :
0.401" (10.20mm)
Length :
0.500" (12.70mm)
Material :
Copper
Material Finish :
Tin
Package Cooled :
D3Pak
Power Dissipation @ Temperature Rise :
1.0W @ 20°C
Series :
-
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
4.00°C/W @ 600 LFM
Thermal Resistance @ Natural :
14.00°C/W
Type :
Top Mount
Width :
1.220" (30.99mm)

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