573300D00010G

Attachment Method :

SMD Pad

Diameter :

-

Height Off Base (Height of Fin) :

0.400" (10.16mm)

Length :

0.500" (12.70mm)

Material :

Copper

Material Finish :

Tin

Package Cooled :

TO-263 (D2Pak)

Power Dissipation @ Temperature Rise :

1.3W @ 30°C

Series :

-

Shape :

Rectangular, Fins

Thermal Resistance @ Forced Air Flow :

10.00°C/W @ 200 LFM

Thermal Resistance @ Natural :

18.00°C/W

Type :

Top Mount

Width :

1.030" (26.16mm)