2283B

Description :
BOARD LEVEL HEAT SINK
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Height Off Base (Height of Fin) :
0.265" (6.73mm)
Length :
0.655" (16.64mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
1.0W @ 40°C
Series :
-
Shape :
Square, Fins
Thermal Resistance @ Forced Air Flow :
17.50°C/W @ 300 LFM
Thermal Resistance @ Natural :
-
Type :
Board Level
Width :
0.655" (16.64mm)

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