2227B

Description :
BOARD LEVEL HEAT SINK
Attachment Method :
Press Fit
Diameter :
0.315" (8.00mm) ID, 1.250" (31.75mm) OD
Height Off Base (Height of Fin) :
0.400" (10.16mm)
Length :
-
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
TO-5
Power Dissipation @ Temperature Rise :
1.8W @ 50°C
Series :
-
Shape :
Cylindrical
Thermal Resistance @ Forced Air Flow :
14.00°C/W @ 200 LFM
Thermal Resistance @ Natural :
21.00°C/W
Type :
Board Level
Width :
-

Produits similaires