Package / Case:
Supplier Device Package:
Output:
Termination Style:
Découvrez les produits 6
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Package / Case Supplier Device Package Output Termination Style Operating Pressure Maximum Pressure
BM1383AGLV-ZE2
ROHM Semiconductor
Enquête
-
-
MOQ: 1  MPQ: 1
MEMS PRESSURE SENSOR IC,PIEZO-R
12-VFLGA CLGA12V025M 16 b SMD (SMT) Tab 4.35 PSI ~ 15.95 PSI (30 kPa ~ 110 kPa) 290.08 PSI (2000 kPa)
BM1383AGLV-ZE2
ROHM Semiconductor
2,716
3 jours
-
MOQ: 1  MPQ: 1
MEMS PRESSURE SENSOR IC,PIEZO-R
12-VFLGA CLGA12V025M 16 b SMD (SMT) Tab 4.35 PSI ~ 15.95 PSI (30 kPa ~ 110 kPa) 290.08 PSI (2000 kPa)
BM1383AGLV-ZE2
ROHM Semiconductor
2,716
3 jours
-
MOQ: 1  MPQ: 1
MEMS PRESSURE SENSOR IC,PIEZO-R
12-VFLGA CLGA12V025M 16 b SMD (SMT) Tab 4.35 PSI ~ 15.95 PSI (30 kPa ~ 110 kPa) 290.08 PSI (2000 kPa)
BM1386GLV-ZTR
ROHM Semiconductor
Enquête
-
-
MOQ: 1  MPQ: 1
PIEZO-RESISTIVE PRESSURE SENSOR,
10-VFLGA CLGA10V020A - Solder Pad - 290 PSI (2000 kPa)
BM1386GLV-ZTR
ROHM Semiconductor
2,998
3 jours
-
MOQ: 1  MPQ: 1
PIEZO-RESISTIVE PRESSURE SENSOR,
10-VFLGA CLGA10V020A - Solder Pad - 290 PSI (2000 kPa)
BM1386GLV-ZTR
ROHM Semiconductor
2,998
3 jours
-
MOQ: 1  MPQ: 1
PIEZO-RESISTIVE PRESSURE SENSOR,
10-VFLGA CLGA10V020A - Solder Pad - 290 PSI (2000 kPa)