- Operating Temperature:
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- Package / Case:
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- Mounting Type:
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- Termination:
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- Output Type:
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- Power - Rated:
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- Conditions sélectionnées:
Découvrez les produits 51
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Mounting Type | Termination | Output Type | Sensitivity | Power - Rated | Sensor Type | Sensing Range | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Package / Case | Mounting Type | Termination | Output Type | Sensitivity | Power - Rated | Sensor Type | Sensing Range | ||
TE Connectivity Measurement Specialties |
8,418
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR PIEZO FILM VIBRA TABS
|
LDT | 0°C ~ 85°C | Cantilever Piezo Film (Wafer) | Through Hole | PC Pins | Voltage | 50mV/g | - | Vibration | 0Hz ~ 180Hz | ||||
TE Connectivity Measurement Specialties |
1,787
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR PIEZO FILM VIBRA MASS
|
LDT | 0°C ~ 85°C | Cantilever Piezo Film (Wafer) | Through Hole | PC Pins | Voltage | 200mV/g | - | Vibration,Acceleration | 0Hz ~ 90Hz | ||||
TE Connectivity Measurement Specialties |
2,981
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MINI SENSE HORIZ MNT VIBRATION
|
LDTC | -20°C ~ 60°C | Cantilever Piezo Film (Wafer) | Through Hole | PC Pins | Voltage | 1.1 V/g | - | Vibration,Acceleration | 0Hz ~ 40Hz | ||||
TE Connectivity Measurement Specialties |
1,187
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR PIEZO FILM VIBRA W/LEAD
|
DT | 0°C ~ 70°C | Piezo Film,Cantilever (Wafer) | User Defined | Wire Leads | Voltage | - | - | Vibration | - | ||||
TE Connectivity Measurement Specialties |
48
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
PIEZO FILM/SILVER INK
|
- | - | - | User Defined | - | - | - | - | - | - | ||||
TE Connectivity Measurement Specialties |
615
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
LDTC | - | Piezo Film,Cantilever (Wafer) | User Defined | PC Pins | Voltage | - | - | Vibration,Acceleration | - | ||||
TE Connectivity Measurement Specialties |
901
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
LDTC | - | Cantilever Piezo Film (Wafer) | Through Hole | PC Pins | Voltage | - | - | Vibration,Acceleration | - | ||||
TE Connectivity Measurement Specialties |
801
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR MINISENSE 100 VERTICAL
|
LDTC | -20°C ~ 60°C | Cantilever Piezo Film (Wafer) | Through Hole | PC Pins | Voltage | 1.1 V/g | - | Vibration,Acceleration | 0Hz ~ 40Hz | ||||
TE Connectivity Measurement Specialties |
1,727
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
PIEZO SENSOR W/LEADS
|
DT | 0°C ~ 70°C | Piezo Film,Cantilever (Wafer) | User Defined | Wire Leads | Voltage | - | - | Vibration | - | ||||
TE Connectivity Measurement Specialties |
243
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
LDT | 0°C ~ 70°C | Piezo Film,Cantilever (Wafer) | User Defined | Wire Leads | Voltage | - | - | Vibration,Acceleration | - | ||||
Knowles |
99
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC ACCELEROMETER VIBRATE SENSE
|
BU | - | Box | Surface Mount | Solder Pads | Voltage | -45dB ±4.5dB | - | Vibration,Acceleration | - | ||||
TE Connectivity Measurement Specialties |
124
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
DT | 0°C ~ 70°C | Piezo Film,Cantilever (Wafer) | User Defined | Wire Leads | Voltage | - | - | Vibration | - | ||||
Omron Electronics Inc-EMC Div |
313
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBR 100-170GAL 0.1A GRN
|
- | -25°C ~ 60°C | - | Chassis Mount | Quick Connect - 0.187" (4.7mm) | Analog | 20 gal | 5V,100nA ~ 30V,100mA | Displacement | 100 ~ 170 gal | ||||
Omron Electronics Inc-EMC Div |
589
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBR 130-200GAL 0.1A BLK
|
- | -25°C ~ 60°C | - | Chassis Mount | Quick Connect - 0.187" (4.7mm) | Analog | 20 gal | 5V,100nA ~ 30V,100mA | Displacement | 130 ~ 200 gal | ||||
Comus International |
617
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION SPST .02A 24VAC
|
- | - | Nonstandard | Through Hole | - | - | - | - | - | - | ||||
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SENSOR SEISMIC 3 AXIS EARTHQUAKE
|
D7S | -30°C ~ 70°C | Module | Surface Mount | Solder Pads | I2C | - | - | Vibration,Acceleration | ±2000 gal | ||||
Omron Electronics Inc-EMC Div |
866
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR SEISMIC 3 AXIS EARTHQUAKE
|
D7S | -30°C ~ 70°C | Module | Surface Mount | Solder Pads | I2C | - | - | Vibration,Acceleration | ±2000 gal | ||||
TE Connectivity Measurement Specialties |
90
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
- | - | Module | User Defined | Wire Leads | - | - | - | - | - | ||||
TE Connectivity Measurement Specialties |
76
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
DT | 0°C ~ 70°C | Piezo Film,Cantilever (Wafer) | User Defined | - | Voltage | - | - | Vibration | - | ||||
TE Connectivity Measurement Specialties |
40
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
FDT | 0°C ~ 70°C | Piezo Film,Cantilever (Wafer) | User Defined | PC Pins | Voltage | - | - | Vibration | - |